Shanghai Techsense Co.,Ltd
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Home
About
Company Profile
Awards & Accolades
Awards & Accolades
Core Advantages
Milestones
Products
Ball Mounter &Inspection/Repair Systems
Flip Chip Systems
Die Sorter
AOI
Laser Systems
Automaton
AGV+Robot
Custom FA
Solutions
行业一
行业二
行业三
News
Careers
Life at Techsense
Job Description
Contact
中文
/
EN
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> Products
Ball Mounter &Inspection/Repair Systems
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Flip Chip Systems
+
Die Sorter
+
AOI
+
Laser Systems
+
Automaton
+
AGV+Robot
+
Custom FA
+
Products
Ball Mounter &Inspection/Repair Systems
+
Flip Chip Systems
+
Die Sorter
+
AOI
+
Laser Systems
+
Automaton
+
AGV+Robot
+
Custom FA
+
半自动BGA植球机
半自动BGA植球机
功能:用于基板或单颗芯片的全自动植球。自动上料,自动定位,pin方式点胶,真空吸附方式植球,视觉检查植球缺陷,最后对接回流炉。
全自动BGA植球机
功能:用于基板或单颗芯片的全自动植球。自动上料,自动定位,pin方式点胶,真空吸附方式植球,视觉检查植球缺陷,最后对接回流炉。
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