Flip Chip Systems - Shanghai Techsense Co.,Ltd

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Ball Mounter &Inspection/Repair Systems+
Flip Chip Systems+
Die Sorter+
AOI+
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Automaton+
AGV+Robot+
Custom FA+

Products

Ball Mounter &Inspection/Repair Systems+
Flip Chip Systems+
Die Sorter+
AOI+
Laser Systems+
Automaton+
AGV+Robot+
Custom FA+

芯片分选机

功能：用于基板或单颗芯片的全自动植球。自动上料，自动定位，pin方式点胶，真空吸附方式植球，视觉检查植球缺陷，最后对接回流炉。

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